Dow Corning® 340 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes, and silicon controlled rectifiers. It can also act as an effective thermal binder for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where cooling properties are required.
Grease-like silicone material thickened with heat conductive metal oxides
High thermal conductivity with low bleeding
No drying, hardening or melting
| Paketleme | 100 GR |