Two-part, 1 to 1 gray silicone elastomer and heat cure and room temperature cure for manufacturing flexibility, thermally conductive encapsulant/pottant for PCB system assemblies providing protection from harsh environmental conditions and thermal management.

Features & Benefits

• Adhesion to aluminum (Al)

• High thermal conductivity 2.7 W/m*K

• Excellent dielectric properties

• Good flowability, easy dispensing

Composition

• Two-part silicone elastomer supplier as flowable liquid

• 1 to 1 mix ratio by weight

Applications

DOWSIL™ TC-6020 Thermally Conductive Encapsulant is suitable for:

• Industry power module

• Automotive control unit